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Introduction With the upgrading of electronic products and the trend of miniaturization,lightness and thinness, it request electronic components to be smaller but performance corresponded to bigger package parts. We have confirmed to this trend and designed DFN0603 package component to replace DFN1006 package component, and DFN1006-3L package component to replace SOT-23 package component, which will save space for circuit board.Such kind of package products would widely application in handset, screen of PC main board, audio, Type-C, NFC and the like of interface for ESD protection.
Features 1.Small size but big power : DFN0603 package component is 80% smaller than DFN1006 package component in size, but the performance for IPP parameter is comparable .
2.DFN1006-3L package component is dual circuit design, which could replace SOT-23 package component or 2 pieces of DFN1006-2L package component. It will save 90% space if took the place of SOD-23 package component.
3.High Reliability.
4.Produced by environmental materials with RoHS compliant.
SPECIFICATION

ESD5V0LTB-DFN1006-3L-1 VESD5V0LZB-DFN0603-2L VESD3V3LZB-DFN0603-2L VESDULC5V0LZB-DFN0603-2L VESDSLC3V3LZBA-DFN0603-2L

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